<p>FC 방법 반도체 기판은 칩에 솔더를 붙이는 범핑 노동을 거치고, 이를 직후집어서(플립칩) 기판에 연결끝낸다. FC 방식은 전선(와이어)으로 칩과 기판을 연결하는 기존 와이어 본딩보다 칩-기판 사이 거리가 짧아 전기신호 손실이 작고 입출력(I/O) 단자 수를 많이 늘릴 수 있습니다.</p>
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Most small flatwork wraps in a few days, with curing protections to reach target strength before heavy use.
<p>김경민 하나금융투자 수석실험위원은 'SK하이닉스는 D램 가격 변동성 완화와 완상품 재고 비중 감소 배경에 따른 최대 수혜주'라며 '내년에 데이터센터, 클라우드, 메타킥보드 관련 설비 투자가 많아지면서 서버용 D램이 실적 성장을 이끌 것'이라고 테스트했다.</p>